8-inch silicon wafers with high precision, abundant inventory, compatible with equipment assembly large stock

Product Specification Description
Size4inch/5inch/6inch/8inch/12inch
Diameter (mm)100mm/125mm/150mm/200mm/300mm/
Thickness (μm)Conventional: 500 – 775μm;
Thin wafers: 150 – 200μm;
Ultra – thin: 10 – 50μm
Orientation <100> <110>< 111>
 Growth MethodCN、FN、FGD、MCZ、NTD
Surface conditionsgrinding (single – side/double – side)
chemical etching
polishing (single-side/doubl-side)
TypeN /P
DopantN:(P)、(As)、(Sb)
P:(B)
Resistivity (Ω·cm)Low resistance / heavy doping: 0.001 – 0.1
Medium resistance: 0.1 – 100
High resistance: 100 – 1000
Ultra – high resistance: > 1000
PuritySemiconductor – grade: 9N – 11N
Photovoltaic – grade: 6N

Thermstars Advantages:

1: No min quantity to order, Mix orders available

2: Factory price with high purity quality guaranteed

3: Fast safe delivery available by express

4: 24/7 hours for after-sale service.

Free worldwide shipping on all orders over $1000

  • OEM& ODM Samples Available
  • Order yours before 2.30pm for same day dispatch
Email:  info@thermstarsdisplay.com
8-inch silicon wafers with high precision, abundant inventory, compatible with equipment assembly large stock
8-inch silicon wafers with high precision, abundant inventory, compatible with equipment assembly large stock
类别(中文)参数(中文)详情(中文)Category (English)Parameter (English)Details (English)
基本参数尺寸8英寸(200mm)Basic ParametersSize8 inch (200mm)
基本参数纯度半导体级 9N~11N,无杂质污染Basic ParametersPuritySemiconductor Grade 9N~11N, contamination-free
基本参数晶体生长工艺直拉法(CZ) / 区熔法(FZ),单/多晶可选Basic ParametersCrystal Growth ProcessCzochralski (CZ) / Float-Zone (FZ), mono/polycrystalline optional
基本参数晶向<100> / <111>(可定制)Basic ParametersCrystal Orientation<100> / <111> (customizable)
电气性能导电类型P型 / N型(可定制)Electrical PerformanceConductivity TypeP-type / N-type (customizable)
电气性能电阻率高精度均匀分布,偏差极小,批次一致性强Electrical PerformanceResistivityHigh-precision uniform distribution, minimal deviation, strong batch consistency
表面与物理特性表面工艺双面镜面抛光(DSP)、化腐去损伤层、离子注入兼容、光刻兼容Surface & Physical PropertiesSurface ProcessDouble-side Mirror Polishing (DSP), damage layer removal via chemical etching, ion implantation compatible, photolithography compatible
表面与物理特性厚度725μm 标准,薄型/超薄型可定制,全规格覆盖Surface & Physical PropertiesThickness725μm standard, thin/ultra-thin customizable, full spec coverage
表面与物理特性表面质量无翘曲、无油污、高洁净、低缺陷、无损伤层、减少制程污染Surface & Physical PropertiesSurface QualityWarp-free, oil-free, ultra-clean, low defects, damage-free, reduces process contamination
机械与热性能综合性能抗热冲击、温差不开裂、耐高温老化、尺寸公差小、安装适配性强Mechanical & Thermal PropertiesComprehensive PropertiesThermal shock resistant, crack-free under temperature swing, high temp aging resistant, tight dimensional tolerance, excellent mounting compatibility
核心优势性能特点少子寿命长、转化效率高、信号损耗低、适配自动化生产、加工适配性强Key AdvantagesPerformance FeaturesLong minority carrier lifetime, high conversion efficiency, low signal loss, compatible with automated production, excellent process compatibility
应用领域核心应用AI芯片、半导体器件、射频器件、薄膜光伏、电力电子器件、芯片制程Application FieldsCore ApplicationsAI chips, semiconductor devices, RF devices, thin-film photovoltaics, power electronic devices, chip manufacturing
应用领域其他应用光伏电站、半导体照明、安防器件、微波器件、通信领域、车载电子Application FieldsOther ApplicationsSolar power stations, semiconductor lighting, security devices, microwave devices, communication industry, automotive electronics
交付与服务现货状态全规格现货充足,覆盖主流与冷门刚需Delivery & ServiceStock StatusAmple stock for all specifications, covering mainstream & niche demands
交付与服务定制服务支持厚度、电阻率、掺杂类型、表面工艺、特殊尺寸全定制Delivery & ServiceCustomizationFull customization for thickness, resistivity, doping type, surface process, special dimensions
交付与服务交付优势工厂直供价、降低光伏热衰减、长期发电稳定、适配批量订单Delivery & ServiceDeliveryFactory-direct pricing, mitigates PV thermal degradation, stable long-term power generation, suitable for bulk orders